Epoxy Adhesive Films & Preforms

Epoxy films are available 2 to 8 mils thick and preforms can be laser or die cut to meet any configuration.E-linking’s electronic grade adhesive films and preforms feature noteworthy characteristics including storage stability at ambient temperatures, fast cures, high bond strength and excellent chemical resistance.

Performance Properties of E-linking Adhesive Films and Preforms

Grades of our epoxy films and performs can be adjusted to meet specific requirements of:

  • Flexibility

  • Electrical/thermal properties

  • Temperature & chemical resistance

Successful industry applications include:

  • Substrate attachment with minimal squeeze out

  • Heat sink bonding

  • Lid sealing

  • Stress absorption

  • Hybrids

  • Connectors and other electronic assemblies

  • EMI/RFI Shielding

  • Structural bonding

  • Static dissipation

Benefits of Film and Preform Adhesives

  • Ready to use

  • Remains in one place after application

  • Bondline uniformity

  • Preforms can be supplied in intricate shapes

  • Can narrow bondline widths

  • Suitable for high volume production


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